Nanocomposite Dielectric Material and Printing Process for Energy Efficient Manufacturing of Printed Circuitry

There is tremendous potential to manufacture printed electronics in a more sustainable, flexible, faster, and less costly way. However, innovations in materials have been required for full scale manufacturing. In their successful Phase I, ChemCubed (C3) developed a nanocomposite dielectric with electrical and thermal properties similar to those of FR4 boards currently used in PCB manufacturing. In the proposed Phase II project, ChemCubed will evaluate all printing and mixing parameters to find the optimal mechanical properties, and scope electrical properties using the new printing technique and the CNT UV curable developed in the P1 effort. Each application requires different properties and this system can be extremely versatile and capable of use in those applications. Completing this work is extremely important to commercialize this opportunity. This material has the physical strength and thermal-resistant properties required to endure the mechanical stress and temperature fluctuations of commercial-scale manufacturing and will have a solder reflow process for component surface mounting. The revolutionary nanocomposite dielectric material will serve as (a) insulating layers between the circuits, (b) masking material for soldering, and (c) support at connection points; thereby allowing it to replace FR4 board on FPCB connections.