Three-Stage Hybridization of Ultra High Thermal Conductivity Heat Sinks and Spreaders for Advanced Radar and RF Components

The results of Phase I showed that a 900 W/mK mechanically stable and CTE matched heat sink for T/RIMM module could be upgraded to 1200 W/mK. Phase II work is aimed at 1) establishing the manufacturing and producibility bases for design and deployment of advanced radar and RF components; 2) demonstrating the technology by fabricating at least two candidate pin cooled 8 channel T/RIMM base plate designs for testing in the dual phase boiling Sub Ambient Cooling System test facility;and 3) designing and manufacturing the thermal management system for the 256 channel MPRDU (Manufacturing & Producibility Radar Demonstration Unit) which will consist of 32 T/RMM base plates, complete with integrated micro heat pipe spreaders. This system will be designed with three times the current heat dissipation capacity required for advanced high voltage GaAs power amplifiers so that the insertion of higher power wide band-gap semiconductor amplifiers such as GaN/SiC will be facilitated. The resulting MPRDU will reduce the government acquisition cost by half and shorten the time for insertion of upgraded technology by half.