Single Chip Phased Array Antenna Elements

"The objective of this proposal is to develop technology that enables direct integration of power and thermal management functions at the component level of transmit and receive phased array antenna modules (TRAM). The project will enable flexible use ofthe highest performance active devices such as PHEMT and HBT GaAs or InP by means of a novel chip-on-chip (COC) flip-chip integration technique. The project will include design, manufacture and test of one integrated circuit each for transmit and receivesides, with each chip providing amplification, phase shifting, signal power routing and control logic. The chip will be manufactured in an advanced silicon on sapphire (SOS) technology called Ultra Thin Silicon (UTSi) CMOS. This advanced technology enablesintegration of RF, IF and base band control functions in a single CMOS chip, a capability which is not possible in any other form of CMOS. Potential system level benefits of this technology would be improvements in antenna performance along with mass, sizeand cost reduction, These will be accomplished primarily through integration of phase shifters, active RF circuitry, RF switching elements and passive devices for both LNA and PA circuits. By flip-chipping GaAs or InP transistors onto the UTSi device(which will contain all passive matching circuits along with active current and temperature control circuits), the highest available performance can be achieved in a monolithic structure.