Analytical Characterization of Sensor/Actuator embedded Intelligent Materials

The objective of this research is to develop a precise analytical depiction of the micro-level stress state in an intelligent material containing sensors and actuators. This state-of-the-art theoretical construct employs classical elasticity solutions, methodologies associated with finite element analysis, and local stress averaging techniques to develop a precise solution to the nonlinear problem presensted by such a material. This will be the first of its kind for an intelligent material system. The analytical model will be experimentally verified with the latest in technological developments for determining the micro-stress fields that exist around embedded inclusions. Experimental verification of this complex analytical problem is a necessity to validate the physical assumptions employed in its development. Therefore, this research represents a significant advancement in the study of intelligent material systems through the development of a direct physical understanding that these embedded devices have on design level properties.