High-temperature Packaging of Planar Power Modules by Low-Temperature Sintering of Nanoscale Silver Paste

High-temperature packaging technologies are needed to help automotive manufacturers reduce the costs of hybrid electric vehicles and future plug-in hybrid electric vehicles. In particular, a new die-attach method is needed for joining power semiconductor chips. This die-attach technology must enable double-side cooled power modules to work reliably at high temperatures. This project will develop technology for the low-temperature sintering of a nanoscale silver paste for die-attaching power chips. Phase I will demonstrate the feasibility of using this technology to enable planar, double-side cooled power modules to work reliably at junction temperatures over 175° C. Phase II will integrate the Phase I results with advancements in other high-temperature packaging technologies, such as substrate and encapsulation, to develop a cutting-edge technology solution for making high-temperature inverters or converters in future electric vehicles. Commercial Applications and other Benefits as described by the awardee: The new packaging technology would provide U.S. automakers with a competitive advantage in the production of cost-effective fuel-efficient vehicles, which, in turn, would help reduce the nation¿s reliance on petroleum imports and decrease carbon emissions.