SBIR/STTR Research Award
High-temperature Packaging of Planar Power Modules by Low-Temperature Sintering of Nanoscale Silver Paste
Award amount
$1,000,000Program and phase
SBIR · Phase IIAward year
2010Award details
- Awarding agency
- Department of Energy
- Branch
- Not reported
- Recipient company
- NBE TECHNOLOGIES LLC
- Proposal award date
- Not reported
- Contract end date
- 2012-08-14
- UEI
- QHNWDF3H2VG5
- Solicitation number
- DE-FOA-0000350
- Topic code
- 24 c
Research abstract
This proposal addresses the Department of Energy
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- SBIR Phase I: PowERazor: an Innovative Electronic Packaging Technology for Manufacturing High-reliability, High-density Power Electronics Modules
- STTR Phase II: Nanoscale Silver Pastes for Low-Temperature Joining of Power Semiconductor Devices
- High-temperature Packaging of Planar Power Modules by Low-Temperature Sintering of Nanoscale Silver Paste
- STTR PHASE I: Nanoscale Silver Pastes for Low-Temperature Joining of Power Semiconductor Devices
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Development of a 1,000 level Borehole Seismic Receiver Array for Characterization of CO2 Repositories
- Sintered Conductive Adhesives for High Temperature Packaging
- Sintered Copper Ink as a Low Cost Replacement for High Temperature Solders
- Solar Energy, Materials Solutions for Cells and Modules
Research funding history
5 SBIR/STTR records share this UEI (2008–2013). Reported award amounts total $1,896,373. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: National Science Foundation, Department of Energy