HIGH PERFORMANCE ALIGNMENT TOLERANT OPTICAL FEED-THRU TECHNOLOGY FOR DEWARS AND OPTOELECTRONICS

"A novel optical FEED-THRU technology is developed in this Phase I SBIR effort. This advanced FEED-THRU technology replaces conventional wires and their issues including thermal conductivity, radiation and electromagnetic susceptibility, and connectorreliability with a dense, wireless, non thermally conductive, alignment tolerant technology that is low cost, highly reliable, and has a greatly reduced electromagnetic interference cross-section. This FEED-THRU technology has the potential to beradiation hardened and leverages an existing optical interconnect technology developed under prior DoD support. The resulting high performance electro-optic dewars and related devices are a technology that has the potential to increase system performanceand lower costs. Advantages provided by this technology include dramatically high thermal isolation, low electromagnetic interference susceptibility, high interconnect density, high interconnect bandwidth, low cost, electrical isolation, redundancy,radiation tolerance, and power reduction. The anticipated benefits of this technology include improved system reliability and lower costs through high thermal isolation, low electromagnetic interference susceptibility, high interconnect density, highinterconnect bandwidth, low cost, electrical isolation, redundancy, radiation tolerance, and power reduction. High performance electro-optic dewars resulting from this technology will find potential ap