Revolutionary Epoxy Technology for High Tg MCM Substrates

The goal of this program is the development of low cost, low viscosity and high performance epoxy resins cured by a novel method, for use in multichip modules (MCM) substrates. The revolutionary epoxy resin, invented by the principle investigator of this proposal, has very high temperature performance (Tg of 280_C to 320_C), low dielectric constant (less than 3), and outstanding moisture resistance. The cost of the resin is comparable to conventional epoxy resins cured and much lower than that of cyanate esters and polyimides. In this proposal. the new resin will be developed especially for applications in electronics. The resins for these applications should meet the conflicting requirements of low viscosity (for ease of processing) and high molecular weight (multifunctionality) to produce high cross-linking density with high Tg. Molecular design, synthesis. formulation and property analysis will be conducted to develop the desirable properties. When completed. the laminates produced from the resins should be completely compatible with conventional established PWB manufacturing procedures. The CCE and its carbon fiber reinforced composites were selected as one of the best inventions by Longman Cartermill Innovation Magazine, June. 1994: reported by High Performance Plastics Magazine, 1993 and Reinforced Plastics Newsletter Magazine, January, 1994 respectively. A program to develop low cost and high performance materials for manufacturing of MCMs is urgently needed for industry. The realizat on of this resin technology should open a market that may exceed $220 million annually within five years for high-density MCM substrates.