High Density Optical Interconnection Technology

The goal of this effort is to develop optical interconnection technology for high performance image processing. Conventional intra-computer electrical communication, for example between multi-chip modules (MCMs), is a limiting problem in future image processors. The pin count needed between high performance image processing MCMs is a problem. In this effort we explore potential high density optical interconnect solutions to this problem that utilize free space propagation of modulated light generated by arrays of Vertical Cavity Surface Emitting Lasers (VCSELs) for both short range and across-board interconnection. Both macro-optical and micro-optical techniques are investigated. Emphasis is placed on ruggedness and relaxing the alignment tolerances required in the physical implementations. The Phase-I effort will produce an integration process for the optical interconnect, and experimental demonstration of the feasibility of this process. In the Phase II follow-on the MCM-to-MCM optical interconnection will be scaled to high densities and demonstrated with SIMD image processing MCMs.