BMDO/02-214B - Nanomaterials Technology for High-Temperature Packaging of Power Semiconductor Devices

"Recent advances in SiC power semiconductor devices offer opportunities for developing smaller, lighter, and more efficient power converters because of the superior switching characteristics of these wide band-gap devices and their ability to function athigh temperatures. However, the state-of-the-art packaging technology based on wire-bonding and solder reflow presents a technical challenge for realizing the full advantages of these devices in a power converter circuit. This Phase I STTR programproposes to develop an innovative nanomaterials technology for packaging these power devices by investigating the use of free-standing nanometal cluster-filled thin films fabricated by a novel ionic self-assembly monolayer (ISAM) process. Since thedriving force for densification of a powder compact increases with decreasing particle size, it is theoretically achievable to densify a nanocluster film at low temperatures. Our joint team between Luna Innovations and Virginia Tech consists ofresearchers with extensive expertise in ISAM process, materials characterization, packaging and assembly, and testing of power devices. Successful completion of this program will provide packaging solutions that fill the gap in the technologicaldevelopment of wide-band gap semiconductor devices for power electronics applications and significantly impact the future growth of the trillion-dollar electronics industry. Successful completion of the proposed project will lead to the development of anovel nanomaterials-based processing technology for high-temperature power semiconductor devices. The technology will enable the military to build more powerful electronic equipments capable of operating at harsh conditions. The technology has a verybroad application in any commercial sectors that involve electronic devices, especially in automobile industries."