Open Topic for Radiation Hardened Microelectronics
Award amount
$1,499,870Program and phase
STTR · Phase IIAward year
2025Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- INNOSYS, INC.
- Proposal award date
- 2025-04-30
- Contract end date
- 2027-04-29
- UEI
- SKSZV1JCCLJ7
- Solicitation number
- 23.C
- Topic code
- MDA23-P001
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Call for Innovative Defense-Related Dual-Purpose Manufacturing Technologies/Solutions with a Clear Air Force and Space Force Stakeholder Need.
- Radiation Resistant Stepper Motors
- Venus Energy Converter
- Extremely High Frequencey Transmitters for Radar Application.
- High average current and high voltage reliable and stable power supplies for high current electron beam sources
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Radiation Hardened Infrared FPA
- Open Topic for Radiation Hardened Microelectronics
- Low Cost Additive Manufacturing of Radiation Shielding Material & Structures
- Radiation Hardened Infrared Focal Plan Array (FPA)
Research funding history
73 SBIR/STTR records share this UEI (2004–2025). Reported award amounts total $33,892,460. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration