STTR Phase II: Nanoscale Silver Pastes for Low-Temperature Joining of Power Semiconductor Devices

This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5). This Small Business Technology Transfer (STTR) Phase II project aims to accelerate the commercialization of an enabling nanomaterial for joining semiconductor chips. The unique features of this innovative material would reduce the manufacturing cost for making lead-free electronics that are required to work in harsh environments and to possess significantly improved performance and reliability over the state-of-the-art technologies. This project focuses on obtaining and sharing extensive scientific knowledge that will lower the risk and barrier for electronic manufacturers worldwide to rapidly implement this nanomaterial in mass production. The broader impacts of a successful project will be to electronics manufacturers in the United States. The U.S. has fallen behind their European and Asian competitors in the move to lead-free products. This enabling nanomaterial will reduce manufacturing complexity and cost, and will help U.S. manufacturers in capturing a significant share of nearly $500 million-dollar market for chip-attach materials.