SBIR/STTR Research Award

Next-Generation Detector and Imager Development

Award identifier 0adb227819fd8f3d09ecc996d47b9bf84db11f826e762750fd0c2183d6d047e4Awarding agency Department of Energy

Award amount

$99,971

Program and phase

SBIR · Phase I

Award year

2010

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
AMERICAN SEMICONDUCTOR, INC
Proposal award date
Not reported
Contract end date
2011-03-18
UEI
C1BNR9HJBQK8
Solicitation number
DE-FOA-0000161
Topic code
44 d

Research abstract

Improvements in silicon-on-insulator (SOI) technology have resulted in development of monolithic chip designs for radiation image sensors and particle detectors by facilitating the use of the handle silicon layer for the detectors and the SOI layer for the readout circuits. Unfortunately, even the most advanced SOI-based imagers are still limited in effectiveness due to threshold (Vt) shifts when bias voltages are applied to fully deplete the handle silicon for detector performance. The required bias voltage range causes severe shifts in the Vt of the CMOS transistors of the readout circuitry. Flexfet SOI

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

22 SBIR/STTR records share this UEI (2002–2025). Reported award amounts total $8,230,994. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration

Agency intelligence

Department of Energy

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