High Reliability Interconnects for Advanced Integrated Circuits in Additive Manufactured Electronics

The innovation in this proposed effort is to capitalize on existing knowledge, AME equipment platforms, processes, and working devices to enhance the durability and ruggedness of AME produced products. The extreme temperature variations study and optimization will establish the material and process set to make AME products reliable. We will specifically study the material mismatch between diverse materials and targeting the weakest link in all electronic circuits - the interconnects. The interconnects will have as many as 4 different materials dynamically interfacing each other: 1) conductive pad, 2) mode dielectric, 3) conductive material, and 4) dielectric substrate. As these materials compress and expand, they will more than likely do so at different rates given the Coefficient of Thermal Expansion (CTE) or each individual material. Our approach will be to model these given the thermal properties and then provide different designs and material options to optimize and secure these connections. We can then rapidly print and test these given the nScrypt 3D 300 series equipment. These results are then used against the models and the models are optimized to produce more accurate results.The Phase 1 objectives are listed below:1. Demonstrate the current state of our packaging capabilities.2. Develop new techniques for higher complexity IC integration.3. Model the thermal effects on our packaging techniques.4. Test the packaging techniques for space relevant conditions.5. Leverage in situ laser processing to increase process speed and reliability.Phase 1 Deliverables include:1. Report on materials and processes used for integration of each package type.2. Physical samples of the critical test structures used for each package type.3. Test report for hot and extreme cold performance of test structures.4. Progress reports at interval determined by contract.nbsp;