Hyperspectral Data Fusion

The objective of the Fast Track, Phase II Plus SBIR effort is to implement the Surface Optics Corporation (SOC) MIDIS electronics that host algorithms used in real-time hyperspectral data fusion into SOA ASIC technology to lower cost and volume of theelectronics. The MIDIS Electronics ASIC Development (MEAD) project will utilize the commercially available MIDIS electronics which are implemented using FPGAs and discrete memories. To satisfy the objective of the Phase II program, the SOC team willconduct the following tasks: (1) Finalize the MIDIS ASIC design specifications and (2) HDL design capture; (3) Develop a simulation test bench and (4) Conduct verification simulations; (5) Synthesize HDL design to selected technology; (6) Develop ASICtest; (7) Conduct MIDIS ASIC physical design; (9) Conduct ASIC fabrication; (10) Conduct prototype hardware design and (12) Test and Deliver a production MEAD device. These items shall be targeted to deliver a MEAD device that will meet the goal of 6inches cubed maximum. Building on SOC's nine years of experience in real-time HSI instruments and algorithms development, the PI's ASIC design experience, Octera's proven ASIC design and development experience, the program will produce a miniaturizedMIDIS electronics which will be less costly to produce to satisfy a variety of military and commerical applications.