SBIR/STTR Research Award

SBIR Phase I: Atmospheric Pressure Molecular Layer CVD

Award identifier 4ff849c1cee46035b29f6e0ceea1945aa62886d5d7604478ace40db0dabb5ab8Awarding agency National Science Foundation

Award amount

$99,918

Program and phase

SBIR · Phase I

Award year

2006

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Award details

Awarding agency
National Science Foundation
Branch
Not reported
Recipient company
TimeDomain CVD Inc
Proposal award date
Not reported
Contract end date
Not reported
UEI
REJ2GMYAKAA7
Solicitation number
NSF 05-557
Topic code
EL

Research abstract

This Small Business Innovation Research (SBIR) Phase I project proposes to demonstrate the feasibility of a novel approach to molecular-layer film deposition. Atomic Layer Deposition (ALD) for barrier layers and thin dielectrics provides unexcelled control of film thickness and conformality, but has been plagued by low deposition rates, film contamination, and high cost. Many of these deficiencies are due to the limited reactant concentrations used in low-pressure operation, combined with the complex pump / purge cycles conventionally employed. Atmospheric-pressure operation, combined with spatial reactant separation, can enable a continuous-processing architecture that promises much higher throughput and lower cost, and high reactant concentrations ensure saturatedmonolayer growth and low contaminant concentrations without unacceptably slow deposition cycles. In this work the company proposes to demonstrate deposition of uniform films of TiN to show the benefits of the atmospheric pressure approach, using a prototype reactor previously constructed. Successful demonstration of the benefits of AP-MLCVD will provide the company with sufficient information to construct a viable alpha-stage commercial tool, in which deposition testing on 200-mm or 300-mm wafers relevant to large-scale integrated circuit fabrication can be performed. Commercially, such full-scale demonstrations are indispensable for commercialization of new processes in the semiconductor manufacturing industry. Atmospheric-pressure operation, combined with spatial-separation-based MLCVD process, makes it possible to construct a high-throughput deposition tool that is simultaneously low in cost, as no load locks or pump down operations are required, and simple circular wafer transport with a single load-unload station can be used. APMLCVD will enable a new generation of deposition processes for controllable fabrication of ultra-thin films of complex materials, such as high-k dielectrics and diffusion barrier layers.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

6 SBIR/STTR records share this UEI (1998–2009). Reported award amounts total $587,963. Reported amounts are not federal obligations.

Phases: Phase I

Agencies: National Science Foundation, Department of Defense

Agency intelligence

National Science Foundation

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