Thermally-Conductive Polymer Nanocomposite Adhesives

The principal technology for removing heat from a device remains thermal conduction. In direct chip attach applications the primary path for heat is through the gap between the chip and a heat dissipation device. The thermal properties of the adhesivesthat fill that gap are increasingly dictating the heat dissipation limits of the package. The thermal conductivity of the adhesives used in the gap can limit how cool a miniaturized circuit will operate. There is a need for polymer adhe-sives with thermalconductivity values in the range of 5-10W/ m K that are electrically non-conductive and have low viscosity with good flow properties. For high-volume-fraction filled polymers, when the thermal conductivity of the filler is about 100x that of the polymer,filler morphology is more important than the intrinsic thermal conductivity of the filler. Recent discoveries in nanocomposites at Aguila Technologies suggest substantial increases in the thermal conductivity of filled, lower-viscosity polymer adhesivesmay be possible through changes in filler mor-phology caused by novel nanosize fillers. The proposal centers on increasing the thermal conductivity of filled electronic adhesives by large factors using recently discovered low-cost nanosize fillers inconjunction with conventional filler materials.There is an immediate need for the proposed high conductivity, low viscosity adhesive in a myriad of high volume consumer and defense products. The market potential for such adhesives exceeds $50 millionwithin 1-2 years. Aguila is working with a major electronics manufacturer that will immediately qualify and apply any improved materials developed.