Device-scale AFM Thermoreflectance metrology: Analytics, Probe design, machine Learning, User experience, and Standards (DATAPLUS)
Award amount
$289,831Program and phase
SBIR · Phase IAward year
2024Award details
- Awarding agency
- Department of Commerce
- Branch
- Not reported
- Recipient company
- LASER THERMAL ANALYSIS, INC
- Proposal award date
- 2024-09-17
- Contract end date
- 2027-04-30
- UEI
- E14VYCEW9YG8
- Solicitation number
- 2024-SBIR-CHIPS-01
- Topic code
- 4
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- LATTICE (Large-Area high-Throughput Thermal Inspection for Complex Electronics)
- Measuring Extreme Thermal Conductivity Ranges using Infrared Components (METRIC)
- A Real-time Automated Plasma Integrated Diagnostic (RAPID) for spatially and temporally resolved evaluation of plasma-exposed surfaces
- Measuring Extreme Thermal Conductivity Ranges using Infrared Components (METRIC)
- Advancing Thermo-Optical Metrology for Integrated Circuitry (ATOMIC)
Research funding history
7 SBIR/STTR records share this UEI (2023–2025). Reported award amounts total $6,383,175. Reported amounts are not federal obligations.
Phases: Phase I, Phase II – Direct to Phase II, Phase II
Agencies: Department of Defense, Department of Commerce