Novel Subminiature Assembly, MEMS Ultrasound, for implementation of SDPSS

Leveraging our expertise in micro-electromechanical systems (MEMS) miniaturization, sensor packaging, and ultrasonic sensing technology, we aim to address the limitations of current air-data systems by investigating two engineering approaches chip-based miniaturization and assembly, and ultrasonic anemometry, to develop a Subminiature Digital Pitot-static Sensor (SDPSS). Initial bare-die pressure sensor choices and supporting electronics chips on a flexible PCB show that both approaches can fit within an initial volume of 0.25" diameter x 5.0" length. The project includes, system level design and modeling, experiments to evaluate key component performance, a combined/down-selected system for a Phase  II pursuit, and a comprehensive final report. Our objective is to meticulously evaluate and integrate the most advantageous features from both the miniaturized electronic pitot-static system and the ultrasonic anemometry method into a cohesive design in Phase II. The process will involve a thorough analysis of each approach's strengths, such as the miniaturization capabilities of the electronic system and the computational robustness of the ultrasonic method.