Modular Open-Architecture Digital/RF Optical Connectivity

The U.S. Navy is seeking development of photonic plug-in module technology and a modeling approach for designing and packaging air platform digital and analog optical communication avionics. To address this Navy need, Intellisense Systems, Inc. (Intellisense) proposes, in Phase II, to continue development of a new Modular Open-Architecture Digital/RF Optical Connectivity (MODOC) technology. MODOC is based on the unique adaptation of existing VITA and MOSA standards for blind-mate optical digital/RF (100 Gbps/100 GHz) interconnects with computer-aided design (CAD) modeling, all supported by digital modeling using the Cameo Systems Modeler to aid the Navy’s digital engineering efforts. Intellisense evaluated the feasibility of supporting new digital and analog/RF photonic components in the context of Modular Open Systems Architecture (MOSA) standards including underlying VITA standards. Specifically, the innovative adaptation of existing VITA and MOSA standards and Systems Modeling Language (SysML) modeling tools achieves high-speed/bandwidth fiber optic (FO) links including new specialty fiber interconnects with the same connectivity and maintenance concepts as current VPX plug-in modules (PIMs). This will result in modification of the VITA standard to support alternative fiber configurations (e.g., dual-core) for balanced photonics links. The MODOC management of the fiber from external MIL-DTL-38999 connector through the backplane and into the PIM ensures these signals are carried as close as possible to the components that require them without requiring conversion or sacrificing signal integrity before arriving at the PIM. In Phase II, we will further research and model the PIM integration concepts leading to the development and accelerated life testing of the photonic PIM prototypes. Root causes of any failures will be evaluated and hardware prototype consisting of two digital PIM prototypes will be assembled and delivered to the Navy along with the  Cameo project and vendor-neutral CAD models. The commercialization goal derived from the effort will be to design, qualify, and manufacture systems leveraging the MODOC-derived designs, thus proving the viability of the updated standards to address innovative FO interface interconnects for defense applications.