Modular Open-Architecture Digital/RF Optical Connectivity

The U.S. Navy is seeking development of photonic plug-in module technology and a modeling approach for designing and packaging air platform digital and analog optical communication avionics. To address this Navy need, Intellisense Systems, Inc. (Intellisense) proposes to develop a new Modular Open-Architecture Digital/RF Optical Connectivity (MODOC) plug-in modules (PIMs), based on the unique adaptation of existing VITA standards for blind mate optical digital/RF (100 Gbps/100 GHz) interconnects coupled to integrated wavelength division multiplexing (WDM) photonics circuits all supported by Systems Modeling Language (SysML) digital modeling. Specifically, the innovative adaptation of existing VITA and modular open systems architecture (MOSA) standards and SysML modeling tools achieves high speed/bandwidth fiber optic (FO) links including new specialty fiber interconnects with the same connectivity and maintenance concepts as current VPX PIMs. As a result, this will result in modification of the VITA standard to support alternative fiber configuration (e.g., dual-core) for balanced photonics links. The MODOC management of the fiber from external MIL-DTL-38999 connector through the backplane and into the PIM ensures these signals are carried as close to the components that require them without requiring conversion or sacrificing signal integrity before arriving at the PIM. In Phase I, Intellisense will use SysML modeling to define the interfaces and concepts between electrical and photonic components, leading to modeling and demonstration of PIM concepts utilizing CAD detailed designs. Risks will be identified and risk mitigation plans developed to support prototyping in Phase II, in which the CAD designs will be realized. In Phase II, we will further research and model the PIM integration concepts leading to the building of the photonic PIM prototypes and performing accelerated life testing. Root causes of any failures will be evaluated and final digital/RF PIM prototypes delivered to the Navy. The commercialization goal derived from the effort will be to design, qualify, and manufacture systems leveraging the MODOC-derived designs, thus proving the viability of the updated standards to address innovative FO interface interconnects for defense applications.