Sub-One PUE through Silicon Cooling Efficiency

To achieve a quantum step in data center efficiency, new thermal management technologies must be coupled to the devices they cool. This proposal seeks to build on recent observations that microconvective cooling not only functions as a high-performance chip cooling technique with the potential for a low PUE, but is also capable of increasing the intrinsic efficiency of the silicon processors themselves by 8-10%. By optimizing the system efficiency with the processor efficiency through intelligent cooling solutions, dramatic leaps in data center efficiency become possible.