Ultra-Compact Microconvective Chill Plates for Electronics Cooling

JETCOOL Technologies uses our advanced microconvective cooling approach and innovative manufacturing processes to build best-in-class cooling modules for microelectronics.  This Phase II program will ruggedize our ultra-compact commercial chill plates to withstand harsh Air Force environments, demonstrating success with a  customized design for an application of interest to an Air Force program. These chill plates, built domestically with our advanced manufacturing techniques, will be tested according to MIL-STD or RTCA specifications as a milestone toward greater adoption in defense and non-defense applications. A Phase III follow-on would include the transition of the technology to the interested AF program as a lighter-weight, higher-performance, and shorter lead time alternative to their current thermal solution.