SBIR/STTR Research Award
Ultra-Compact Microconvective Chill Plates for Electronics Cooling
Award amount
$48,815Program and phase
SBIR · Phase IAward year
2020Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- JETCOOL TECHNOLOGIES INC
- Proposal award date
- 2019-12-12
- Contract end date
- 2020-12-12
- UEI
- EMTUCUWPLWK9
- Solicitation number
- DoD SBIR X19.2
- Topic code
- AF193-CSO1
Research abstract
Chill plates keep high power electronics cool across many industrial and defense applications. However, chill plates haven’t seen true innovation in over 20 years. Their inability to cool today's advanced electronics is stifling the next generation of high power devices. Using new fluid dynamic methodologies and advanced manufacturing techniques, JETCOOL produces microconvective chill plate with 10x better heat transfer in 10x smaller packages.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Sub-One PUE through Silicon Cooling Efficiency
- Lightweight Power Converter Cooling with Enhanced EMI Characteristics
- Fan-less Cooling for Compute at the Tactical Edge
- Ultra-Compact Microconvective Chill Plates for Electronics Cooling
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- FA442723R1002 eJARVIS Project (MacDill and JBMDL) Solicitation
- Directed Energy Deposition Additive Manufacturing (AM) Functionally Graded Material (FGM) Components
- 3D Interactive Instructions for RSO & Maintenance Community
- BATTLEFIELD REFLECTOR FOR ISOLATED TRAVELERS EVERYWHERE (BARFITE)
- Locoal Charcoal Company Wood Fired Backup Generator
Research funding history
5 SBIR/STTR records share this UEI (2020–2023). Reported award amounts total $2,192,798. Reported amounts are not federal obligations.
Phases: Phase I, Phase II – Direct to Phase II, Phase II
Agencies: Department of Defense, Department of Energy