Low Temperature Plasma Enhanced Processing for Microelectronics Manufacturing

In this SBIR proposal, an innovative low temperature annealing processing technology will be developed for the applications of: • Advanced Semiconductor CMOS low temperature, such as dopant activation, silicide formation, and post dielectric treatment • Post integrated circuits (ICs) or charge-coupled devices (CCDs) processing, including the formation of PN junction on the back side of wafers • Advanced annealing or formation for metal, biochemistry, or other new materials Current, commonly used annealing processes for dopant activation require temperatures higher than 600°C. For future advanced microelectronics, nanotechnology, and biotechnology applications, lower process temperatures are needed. In this proposal, a low temperature annealing technology will be developed based on innovative multiple energy sources processes. The technique combines several sources of energy to achieve high-level dopant activation at low temperatures. This process is compatible with integrated circuit sensor fabrication. During phase I, MicroSol has demonstrated the 500°C activation, and fabricated working diodes. MicroSol has also started collaboration with potential customers. In Phase II, we will systematically develop surface energy enhanced annealing recipes at temperatures as low as 400°C for process in the semiconductor manufacturing. The low temperature processed used for post IC will be developed and characterized. An initial prototype will be designed and built. After phase II, the company will work with semiconductor equipment company to co-develop commercial equipment. The wafer demo and equipment field testing will be performed. The broad areas of application for this low temperature technology include the internet of things (IoTs), supply chain management, industrial process monitoring, security and surveillance, health/medical monitoring, remote and hazard environment monitoring, smart buildings, and other wearable electronic applications.