SBIR/STTR Research Award
Nonplanar Spaceborne Additively Manufactured Electronics
Award amount
$149,969Program and phase
STTR · Phase IAward year
2023Award details
- Awarding agency
- National Aeronautics and Space Administration
- Branch
- Not reported
- Recipient company
- MICRO-PRECISION TECHNOLOGIES, INC.
- Proposal award date
- 2023-08-01
- Contract end date
- 2024-09-02
- UEI
- HF3AKRDE1MN1
- Solicitation number
- STTR_23_P1
- Topic code
- T12
Research abstract
Micro-Precision Technologies, Inc. (MPT), in partnership with the Center for Advanced Microelectronics Manufacturing (CAMM) at Binghamton University, will develop a commercially-ready process for spaceborne additively manufactured electronics (AME) combining the ruggedness and reliability of MPTrsquo;s thick film ceramic technology with the design freedom of CAMMrsquo;s aerosol jet printing technology. The combination of these technologies allows the production of AME circuits on any arbitrary nonplanar surface with demonstrated compliance to IPC, NASA, and DOD standards for spaceborne printed circuit boards. These nonplanar space-qualified AME circuits will be used in space and terrestrial applications that require operation in extremely harsh environments but have severe or unique volume constraints that cannot accommodate traditional planar printed circuit boards.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- NSN 5961-01-053-3316 Source Approval
- High Operating Temperature Spaceborne Electronics
- GeoFire Real-Time Wildfire Alert System
- NSN 5962-01-217-1430 Source Approval
- 04b Quick-Turn Spaceborne Printed Circuit Boards
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Novel Construction of Lunar Landing Pad Reinforcement Structures
- Brickbot for Lunar Surface Subscale Technology Demonstration
- Additively Manufactured Electronics for Extreme Environmental Conditions
- Resistance Welding of Carbon Fiber Reinforced Thermoplastic Composites for Repurposable Applications
- Low-Cost Manufacturing of Reusable Thermal Protection Systems (TPS)
Research funding history
14 SBIR/STTR records share this UEI (2015–2025). Reported award amounts total $4,773,324. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Agriculture, National Aeronautics and Space Administration, Department of Energy, National Science Foundation