High Efficiency, Low Size and Weight and Power (SWAP) Solid State Power Amplifiers (SSPAs) for Sensor Applications

In the Phase 1 program, ENGIN-IC studied the key technologies to develop a 200-W Solid State Power Amplifier (SSPA) utilizing novel, highly efficient GaN HEMT MMICs, low loss combiners, and manufacturing techniques to minimize the size of the SSPA module.   In Phase 2, ENGIN-IC will advance these designs with high TRL level demonstrators.  A GaN MMIC amplifier with 32-W saturated output power, 25-dB large signal gain and 48 to 52% power-added-efficiency (PAE) will be demonstrated.  Modular sub-assemblies with more than 60-W output power and 45% efficiency will be demonstrated, using this MMIC.  These sub-modules will be combined through a low-loss waveguide combiner resulting in a SSPA with more than 200-W output power and 40% efficiency across the specified Ku-Band frequency range.  Hybrid packaging techniques allow for a compact modular integrated microwave assembly with an innovative cooling approach to maintain reliable operation through extreme environments.  The technologies will be qualified with testing to extreme program environments and will be available for immediate use in production systems.  These technologies solve key system issues including high efficiency amplifier power generation and density, cooling, size constraints, and low loss combining.  These technologies can all be adapted to support future system acquisition objectives through scaling of MMIC frequencies, bandwidth, output power, and module combining quantities.