Efficient Processing of Low Variability Printed Resistive Films (1022-002-014)

SI2 Technologies, Inc. (SI2) proposes to further develop and mature its Direct Write Resistive Film product to meet Air Force defined requirements. SI2’s Resistive Film product has the potential to benefit the AF through the availability of a cost effective, low scrap, accurate, and precise family of Resistive Film products.  Specifically, SI2’s proposed solution is to further develop the digital manufacturing process to first produce polyimide based resistive film products between 100-4000 OPS with a coefficient of variability (COV) <5%.  SI2 will then utilize a similar method (low-thermal mass process, materials, and equipment) to manufacture resistive film products between 100-4000 OPS with a COV <5%.  A low-thermal mass process will be optimized to accurately and reproducibly manufacture resistive films on polyimide and alternate substrates.  SI2’s Direct Write roll-to-roll web-handling equipment will be upgraded to stabilize the web as it moves from the printer, through the oven, and to the take-up system to enhance stability and further minimize electrical variability.  The materials and processes required to manufacture other resistive film product forms such as C-Sheets, Striped Resistive Films, and fine grids will be optimized.  SI2 will then determine how to best integrate an in-line low-thermal mass curing system into the roll-to-roll print line.  The optimized materials, equipment, and low-thermal mass processes used to manufacture resistive films between 100-4000 OPS with a COV