SBIR/STTR Research Award

Entangled Photon Pair SourceBased On Thin-Film Lithium-Niobate-On-InsulatorPhotonic Integrated Circuits

Award identifier f1a929982e490cc052abdf16243bcc139b888ce4a9f31a5d66e5292ad126540fAwarding agency National Aeronautics and Space Administration

Award amount

$749,991

Program and phase

STTR · Phase II

Award year

2023

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
PHASE SENSITIVE INNOVATIONS INC
Proposal award date
2022-12-20
Contract end date
2024-12-19
UEI
LJMKLES23319
Solicitation number
STTR_21_P2
Topic code
T5

Research abstract

Herein, PSI propose a system-on-chip (SoC) solution for an entangled photon pair source (EPPS) based on thin-film lithium niobate on insulator (TFLNOI) photonic integrated circuits (PIC). Using integrated photonic devices such as fiber coupler, waveguide, modulator, splitter/combiner and micro-ring, the proposed EPPS can generate and process the entangled photons with high efficiency and speed. In phase I effort, we developed theoretical models to study the spontaneous parametric down conversion (SPDC) conversion efficiencies based on both hybrid and ridge waveguide LNOI PIC designs. We have successfully demonstrated an in-situ monitored periodically poling process with small poling periods and large poling gaps. Leveraging other on-going PSI projects, we have also fabricated and characterized the key PIC components for the proposed EPPS chip, including low-loss waveguides, fiber coupler, high extinction splitter/combiner, micro-ring resonator and high-speed modulator. The phase I result paved a solid foundation toward a high-efficiency EPPS PIC chip. In phase II, we will continue the PIC components development focusing on the ridge waveguide designs, and experimentally demonstrate all the key PIC components. We will further refine the periodically poled LNOI (PPLNOI) process with improved accuracy and automation. Through the collaboration with RIT, our subcontractor, who has significant experiences in quantum photonic system testing and characterization, we will demonstrate the entanglement of the SPDC generated photon pair. Lastly, we will perform initial integration and packaging for the EPPS chip based on advanced photonic wire-bonding technology. Based on our pioneer work in TFLNOI PICs development and with our successful experiences in commercialization of SBIR research efforts, PSI is poised to develop, package, qualify and commercialize the proposed EPPS chip for tomorrowrsquo;s quantum communication demands.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

69 SBIR/STTR records share this UEI (2010–2025). Reported award amounts total $32,859,234. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Commerce, Department of Energy

Agency intelligence

National Aeronautics and Space Administration

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