American Manufactured Conductive Inks for Additive/Agile Manufacturing for Advanced Semiconductor Packaging

For the last two decades, the U.S. lead in the semiconductor chip industry has steadily eroded as foreign competition — especially the Chinese government’s massive push to develop global technology dominance — has stolen market share and begun to overtake our technological advantage. China has poured billions of dollars into initiatives to overtake the West as a leader in technology such as 5G networks, biotechnology, quantum computing and artificial intelligence. China’s goal is to be the global leader in chip manufacturing by 2030.    This is where Electroninks, the world leader in particle-free conductive inks, can help restore America’s semiconductor advantage. Our metal-based inks create pure metallic films on a dizzying array of parts and components, with applications from agile printed circuit boards to chip manufacturing to EMI/RF shielding to metalization of parts. Because these patented inks do not contain binders and fillers, they are able to produce conductivity ratings with much higher than industry standards, allowing massive reductions in precious metals used and minimum layer thickness required.     Because of the high conductivity of Electronink’s products, they are a perfect candidate in advanced semiconductor manufacturing technologies like advanced packaging and heterogeneous integration. Advanced packaging offers a new avenue to scale computing power and regain our technological edge. IC packaging allows layer after layer of transistors to be stacked in 2.5D and 3D packages. Heterogeneous integration refers to the integration of separately manufactured components into a single assembly, or system in package (SiP), that provides higher-level functionality overall.    During the course of our Phase I customer discovery, Electroninks discovered that the Air Force Research Laboratory’s Highly Integrated Microsystems Branch, Sensors Directorate, (AFRL/RYDI) has a mission-critical need to develop new and better semiconductor packaging and new sensor components technologies. These complex technologies form the trusted building blocks critical to high performance signal processing as required to meet size, weight, power, and cost constraints for future high performance Air Force ISR Anti-Access/Area Denial applications. During the Phase II effort, Electroninks will conduct RDT&E to enhance our core product, particle-free conductive ink, specifically for advanced packaging applications with AFRL/RYDI. Objectives include: Conducting basic R&D/RDTE testing of core properties of silver conductive films; Conducting RDTE testing and scoping for Inkjet and Aerosol Jet Printing; Conducting R/R&D to validate print properties and printing stability; Conduct RDTE Print Testing on structure(s) or devices per patterning requirements; and Conducting RDTE seed and plate testing.