Lightweight Interconnects for Dynamic FHE Aerospace Environments

The next wave of revolutionary progress in electronics will greatly rely on easily customizable electronic devices and systems that can be quickly and affordably manufactured with various miniaturized, lightweight components onto rigid and flexible substrates.  Sunray Scientific’s revolutionary ZTACH®ACE magnetically aligned Anisotropic Conductive Epoxy is the basis for realizing manufacturing of multifunctional stretchable electronics through simple integration into existing surface mount technology (SMT) manufacturing processes.  This innovative interconnect technology will be used as a replacement for solder attach and is proven through other trials to increase reliability by enhancing adhesion, increasing dynamic flexibility, and improving vibration/shock resistance. This interconnect technology will enable high volume production capability across a wide array of stressing aeronautical and aerospace applications. Ensuing flexible hybrid electronics (FHE) maturation makes possible wide array of commercial applications: medical devices, human Wearable and Implantable Body Sensors, OLED Patch Displays, micro-RFID systems, automotive systems, and beyond.    Partnering with Rochester Institute of Technology, Lockheed Martin and AFRL, the articulating wings and control surfaces of the selected LM-UAV for this proposal will serve as a technology demonstrator for FHE and harnesses incorporating SunRay’s ZTACH® ACE.  Phase 1 objectives will demonstrate the integration of SunRay’s wide range of high-performance materials including ZATCH ACE, processing techniques, initial reliability characterization and performance, costs, and life-cycle benefits. Additional benefits include reduced conformal size, reduced thickness, and lighter weight combined with excellent shock, vibration, and chemical resistance leading to highest functional device reliability. The project outcomes will demonstrate the ease of integration and reliability of SunRay’s materials and processes for flex-to-flex and flex-to-rigid interconnection.