Advanced Electronic Interconnects for Robust Fine-Pitch Microelectronic Sensor Systems

Current Infrared Sensors are expensive, heavy, bulky, have limited performance/reliability in extreme conditions, and reliance on overseas supply chain. SunRay will use its ZTACH« ACE novel interconnect technology to replace solder and wire bonds for infrared sensors produced by Teledyne Technologies, resulting in 3X SWaP-C improvement, domestic production, simplified manufacturing process, and reliability in extreme conditions. These new imaging sensors bring numerous Army benefits, including being smaller, less expensive, lower power consumption, and improved resolution. This allows for threat detection earlier and faster with greater accuracy in instances such as chemical warfare and adversarial identification and targeting. Creating a slim and compact, very low weight, light weight, low-power (long battery life) sensor enables more, smaller systems to be available to the warfighter therefore enhancing threat recognition. The technologies allow for helmet, drone/UAV, crawler integration, providing visibility through smoke, haze, and fog for situational awareness and ability to augment with chemical or material identification for significant warfighting advantage. The technology will allow for extensive offensive capabilities and operational effectiveness, enhancing survivability and minimizing warfighter exposure. Commercial applications of this technology include gas sensing, chemical sensing, space applications, cancer detection, and food sorting.