Advanced Packaging of 5G / 6G Beamforming Integrated Circuit (BFIC) with Next Generation Anisotropic Conductive Materials
Award amount
$74,586Program and phase
STTR · Phase IAward year
2023Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- SUNRAY SCIENTIFIC INC.
- Proposal award date
- 2023-05-12
- Contract end date
- 2023-08-14
- UEI
- PZPHRDAUMF19
- Solicitation number
- X23.D
- Topic code
- AFX23D-TCSO1
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- On-textile integration of sensors, power, control and communications for advanced wearables
- Advanced Electronic Interconnects for Robust Fine-Pitch Microelectronic Sensor Systems
- Lightweight Electrical Interconnects for Aerospace Environments
- Rapid, UV-Cure Multifunctional Conductive Material for SWaP-C Improvement across Aerospace
- Development of FOB Electronic Circuit Repair Kits Using Advanced Multifunctional Conductive Materials
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Radiation Threat Mitigation System to Enhance Resilient, Rapidly Deployable Proliferated Warfighter Space Architectures
- Streamlining Acquisition Operations with Generative AI-powered Natural Language Search
- NEXT GENERATION SOFTWARE SUPPLY CHAIN SECURITY
- Efficient and Reliable Multi-kernel Plasma Ignitor for Hypersonic Scramjets
- Machine Learning Security (MLSec) Attack Workbench For Red Teaming Of Autonomous Assets
Research funding history
20 SBIR/STTR records share this UEI (2017–2024). Reported award amounts total $8,841,829. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Energy