Thermal and Magentic Packaging for Large Superconducting Systems

In this program, we propose to develop manufacturable HTS MCM technology for integration into LTS radio receivers. First, we will generate the final designs for an individual functional 20x20 mm (or larger) MCM based on HTS material.  We will then have the design fabricated. We will test these devices to see if the temperatures and environment necessary for the integration of HTS wafers into MCM structures is possible. Finally, we will explore whether the parameters discovered in Phase I will match integration into the SFQ5ee and MCM processes at MIT Lincoln Laboratory, which are the assumed sources of any GFP materials. In the option, we will complete the realization of the first functional prototype and begin to iterate the most problematic aspect of the realized packaging design. Successful completion of these tasks will give us the building blocks to then construct and demonstrate a power limiting channelizer bread board in Phase II to demonstrate improved source and receiver capabilities.