Cryogenic Magnetic Shielding of Superconductor Chips

The multi-faceted field of cryogenic packaging of superconductor integrated circuits (ICs) encompasses a vast array of engineering disciplines and remains somewhat immature for large IC sizes. Excellerix proposes to develop this critical infrastructural area to support all future growth of the superconductor ICs and multi-chip modules (MCMs). In particular, the proposal aims to emphasize the thermal and magnetic facets of cryopackaging. Our goal is to design and implement a package which optimizes both thermal and mechanical properties. Principally, the design needs to be insusceptible to magnetic fields. In Phase I, we intend to assess the advantages and liabilities of various magnetic shielding approaches, decide on the best design, finalize the construction of a cryogenic package, and test the thermal and magnetic properties of a large packaged MCM. In Phase II, we intend to develop a complete modular and versatile cryopackage with all high and low frequency wiring that will integrate with various cryocoolers.