Design and Fabrication of the HDSoC- High Density Digitizer System-on-Chips
Award amount
$199,925Program and phase
SBIR · Phase IAward year
2020Award details
- Awarding agency
- Department of Energy
- Branch
- Not reported
- Recipient company
- NALU SCIENTIFIC, LLC
- Proposal award date
- 2020-02-18
- Contract end date
- 2020-11-17
- UEI
- ZFYUKU9F8TQ4
- Solicitation number
- DE-FOA-0002145
- Topic code
- 32b
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- WHISPER: Waveform-based High-speed Intelligent Signal Processing for Enhanced Readout
- Design and development of the LID - LGAD Integrated Digitizer
- Design and Development of MU-STAR: a MUlti-channel Streaming Autonomous Readout digitizer for large channel count readout
- Design and Development of SyMPET: System on chip Modular readout for high-resolution TOF-PET
- (COSMOS) Compact Standoff Biomolecular Observation System
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Design and fabrication of the HDSoC- High Density digitizer System-on-Chip
- CF Tech's technology for purifying radioisotopes allows for better separations with faster and less expensive processing than traditional methods.
- Optimization of Additive Manufacturing Technique for 3D Superconducting Multi-Qubit Systems
- Supercritical Fluid Separation and Purification of Rare Earth Elements, particularly Lanthanides including 177-Lu, to Lower Energy Consumption, Reduce Processing Time and Reduce Wastes
- Optimization of Additive Manufacturing Technique for 3D Superconducting Multi-Qubit Systems
Research funding history
33 SBIR/STTR records share this UEI (2016–2025). Reported award amounts total $14,748,717. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Energy, National Aeronautics and Space Administration, Department of Health and Human Services, Department of Defense, Department of Commerce