Readout Integrated Circuit for Low Cost Infrared Focal Plane Arrays

A significant appeal of reduced-scale aircraft is the relatively low replacement cost; it is therefore counter-productive to install high-cost infrared imaging systems on these aircrafts. SunRay Scientific proposes to reduce the cost of IR imaging systems by eliminating a significant cost in camera fabrication—aligning and soldering vertically stacked circuits. Currently, circuits are interconnected using “bump bonding”, which requires indium bumps on opposing circuit faces to be precisely aligned then melted together using pressure and heat rather than needing an additional underfill process. Bump bonding is time consuming and results in low yield due to broken interconnects and heat or pressure damage to the circuits. ZTACH Anisotropic Conductive Epoxy (ACE) is a paste applied between circuit faces. Within a magnetic field it self-assembles into conductive columns that establish high-density interconnects between opposing circuit faces without the use of solder, pressure, or high heat. ZTACH ACE eliminates precision alignment, improves ruggedness, acts as its own underfill and reduces processing steps. These advantages enable higher-throughput manufacturing and improve yield. ZTACH ACE bonds are flexible and provide excellent heat conduction. ZTACH ACE provide a cost-effective platform for mass production of wearable devices that are flexible, rugged, and feature-rich.