Ink-based 3D Electronics Printing for Missile System Applications

Existing digital printed electronics systems are predominately based on 2D rigid printed circuit boards and manufacturing methods using nonintegrated tools and processes. Healthcare and communications industry, as well as Federal and DoD are pushing for smaller, flexible, and wearable electronic devices, and in particular 3D printed microelectronics that conform to complex shapes. Members of 3DFlexible, Inc., have already embarked over three years ago and have solved various issues using special tools and developing new 3DPE processes for development of electronic, RF, and optical components. For true electronic 3D digital manufacturing, our system performs all printed electronics functions automatically on one machine (up to 10, including inkjet, pick-n-place, curing, laser sinter, laser cut), on any curved surface, which is crucial for missile system applications, and performs both additive and subtractive printing without manual recalibration. Our 3DFlexible machine already exists as a preproduction unit, and has produced novel 3D shaped electronics devices. In recognition of our accomplishment, the technology of our team was selected as one of the top three innovative transferable technologies developed by the Laboratory for Physical Sciences (LPS) for DoD. Approved for Public Release | 18-MDA-9817 (23 Oct 18)