Rugged, Printed Electronic Components for Structurally-Integrated Missile Circuitry (1000-470)

SI2 Technologies, Inc. (SI2) proposes to develop structurally-integrated printed electronics for interceptors that conform to the contours of the missile body. Leveraging SI2’s extensive electronics design, additive manufacturing (AM), and structural design experience, SI2’s flexible electronics will be adapted to the shape or form of the embedded structure and will withstand launch and space system environments. SI2’s AM approach will ease component fabrication and reliable installation within the missile body. In Phase I, SI2 will develop printed electronic components for evaluation. The Phase I effort will culminate in the development of a printed circuitry demonstrator. In Phase II, the most promising printed circuitry concepts will be downselected and optimized to support the building and testing of advanced prototypes. With support from industry partners, SI2 will then identify opportunities to transition its printed electronics technology to the DoD. Approved for Public Release | 18-MDA-9817 (23 Oct 18)