Ink-based 3D Electronics Printing for Missile System Applications

Missile system development would benefit if electrical and electronic devices could be conformally printed on structural components. Additive Manufacturing (AM) technologies capable of creating electronics on flexible substrates offer the possibility of integrating circuitry throughout missile structural and support systems. Ink-based printing has been demonstrated to produce flexible, conformal electronics. Localized Laser Chemical Vapor Deposition (CVD) can surpass some ink-based printing limitations and produce 3D printed electronics on a variety of substrates at high resolutions. Our Phase I R&D will produce a prototype localized laser CVD AM apparatus for demonstrating 3D deposition of electronic circuits on substrates. The results from this project will provide Phase II design data for developing a commercially viable localized laser CVD AM microelectronics printing technology. The benefit of this AM process will be a greater range of materials, sizes, and part geometries that can be used for conformal microelectronics. Commercial uses include aerospace applications requiring reduced size and weight, biomedical and wearable electronics, and consumer electronics devices. Our commercialization effort will focus on developing the localized laser CVD AM printing capability and offering complete systems along with technology licensing and consulting to AM equipment manufacturers. Approved for Public Release | 18-MDA-9817 (23 Oct 18)