Multi-Material Additive Manufacturing of Low-SWAP-C Antennas and RF Devices (1000-442)

SI2 Technologies, Inc. (SI2) proposes to develop polymer/ceramic composite electromagnetic (EM) materials and low-temperature processed, high-conductivity inks for multi-material additive manufacturing (AM) of antennas.The proposed program will provide a pathway to designing and easily fabricating low-SWAP-C multi-material AM antennas and other RF devices that cannot be manufactured using traditional means.This will reduce the logistical burden of storing and transporting antennas and RF components in the field.SI2 offers a unique combination of AM experience and RF design expertise for the development of cost-effective, 3D-printed antennas.In Phase I, prototype filaments (suitable for printing with an nScrypt printer) of differing dielectric constants will be produced and a maximum relative permittivity of 15 will be demonstrated.SI2 will also perform research into methods for increasing the conductivity of low-temperature processes conductive inks printed on composite polymer substrates to 10X less than bulk copper (i.e. 5.8x10^6 S/m).Lessons learned from SI2s Phase I materials development effort will be applied in Phase II to the fabrication of an AM antenna structure in a fully-automated process and in a single print.