Multi-Material Additive Manufacturing of Low-SWAP-C (1000-509)

SI2 Technologies, Inc. (SI2) proposes to develop a multi-mission antenna structure fabricated via a fully-automated, additively manufactured (AM) process in a single print. SI2 will leverage its experience in the development of polymer/ceramic composite based electromagnetic (EM) materials and low-temperature processed, high-conductivity inks for these multi-material antennas. Feedstock filaments (suitable for printing with an nScrypt printer) of differing dielectric constants will be produced and a maximum relative permittivity of 15 will be demonstrated. SI2 will also increase the electrical conductivity of its conductive inks (targeting a conductivity of 10X less than bulk copper, i.e. 5.8x10^6 S/m) for improved power efficiency. The proposed program will provide a pathway to designing and easily fabricating low-SWAP-C multi-mission antennas and other RF devices that cannot be manufactured using traditional means. This will reduce the logistical burden of storing and transporting antennas and RF components in the field. SI2 offers a unique combination of AM experience and RF design expertise for the development of cost-effective, 3D-printed antennas. SI2’s Phase II antenna will be evaluated with regard to its RF performance and environmental ruggedness. With support from industry partners, SI2 will then identify opportunities to transition its printed antenna technology to the DoD.