SBIR/STTR Research Award
3D Printed Component Packages for Semiconductor Die
Award amount
$154,996Program and phase
SBIR · Phase IAward year
2018Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- ENGENIUSMICRO LLC
- Proposal award date
- 2017-11-06
- Contract end date
- 2019-01-05
- UEI
- JF8WG2W8RR53
- Solicitation number
- 2017.2
- Topic code
- MDA17-011
Research abstract
This proposal seeks to develop a 3D printing process to print a 3D package around a bare semiconductor die where the package is tailored to fit the application. When semiconductors are fabricated, they are typically sent to a foreign country for packaging. Within the foreign country, it is possible the part is counterfeited. 3D printing of a component package around a bare die should allow for the manufacturer to keep the packaging at the same location as the die manufacturing and reduce the risk of counterfeiting. During the Phase I effort we will develop and conduct proof-of-principle demonstrations of the process and provide evidence of adherence to MIL-PRF-38535.Approved for Public Release | 17-MDA-9395(24 Oct 17)
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Additive Cofired Ceramic Electronics for Space Systems (ACCESS)
- Additive Manufacturing Tools for Reverse Engineering?
- Manufacturing Innovations for Next-gen Technologies in hypersonic vehicles (MINT)
- Tethered Drone RF Optimized Nodal Element (T-DRONE)
- Compact Metamaterial-Enabled High Power Microwave Antennas
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- 3D Printed Component Packages for Semiconductor Die
- 3D Printed Component Packages for Semiconductor Die
- 3D Printed Component Packages for Semiconductor Die
- Universal Additive Manufacturing Packaging (UAMP)
Research funding history
58 SBIR/STTR records share this UEI (2007–2025). Reported award amounts total $26,395,686. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Science Foundation, National Aeronautics and Space Administration, Department of Energy