SBIR/STTR Research Award

Universal Additive Manufacturing Packaging (UAMP)

Award identifier 807719d17d70eec68804c79929ce3af3bdb4f15d5217e3e7bdd984b07822780eAwarding agency Department of Defense · Missile Defense Agency

Award amount

$100,000

Program and phase

SBIR · Phase I

Award year

2018

Award details

Awarding agency: Department of Defense
Branch: Missile Defense Agency
Recipient company: INTERLOG CORPORATION
Proposal award date: 2017-11-06
Contract end date: 2018-05-05
UEI: YM98JD6XG4G1
Solicitation number: 2017.2
Topic code: MDA17-011

Research abstract

The MDA is seeking a new additive manufacturing (AM) process compliant with MIL-PRF-38535 for a semiconductor die packaging to reduce potential risks and susceptibility of counterfeiting via on-site packaging and anti-counterfeit measures. Interlog Corporation proposes to develop a new Universal Additive Manufacturing Packaging (UAMP) process that provides ultrafine die-packaging, not only for old packaging (QFP/PGA/BGA) but also new packaging types (FCBGA/WLSCP, 3DIC, etc.), on a single AM platform using novel, combined layer deposition/bonding methods. The innovation of UAMP is a novel heterogeneous bonding method optimized for die-packaging for various packaging elements. In Phase I, Interlog Corporation will develop a TRL 4 prototype for a laboratory demonstration with key UAMP process design and performance requirements.Approved for Public Release | 17-MDA-9395(24 Oct 17)

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

8 SBIR/STTR records share this UEI (2016–2025). Reported award amounts total $1,074,816. Reported amounts are not federal obligations.

Phases: Phase I

Agencies: Department of Defense

Agency intelligence

Department of Defense

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