SBIR/STTR Research Award
3D Printed Component Packages for Semiconductor Die
Award amount
$985,692Program and phase
SBIR · Phase IIAward year
2019Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- ENGENIUSMICRO LLC
- Proposal award date
- 2019-03-14
- Contract end date
- 2021-03-13
- UEI
- JF8WG2W8RR53
- Solicitation number
- 17.2
- Topic code
- MDA17-011
Research abstract
This proposal has potential commercial benefits of providing packaging for obsolete semiconductor die or small runs of semiconductor die. Additional commercial benefits include providing more versatile packaging options than currently exist. Approved for Public Release | 19-MDA-9932 (21 Feb 19)
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Additive Cofired Ceramic Electronics for Space Systems (ACCESS)
- Additive Manufacturing Tools for Reverse Engineering?
- Manufacturing Innovations for Next-gen Technologies in hypersonic vehicles (MINT)
- Tethered Drone RF Optimized Nodal Element (T-DRONE)
- Compact Metamaterial-Enabled High Power Microwave Antennas
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- 3D Printed Component Packages for Semiconductor Die
- 3D Printed Component Packages for Semiconductor Die
- 3D Printed Component Packages for Semiconductor Die
- Universal Additive Manufacturing Packaging (UAMP)
Research funding history
58 SBIR/STTR records share this UEI (2007–2025). Reported award amounts total $26,395,686. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Science Foundation, National Aeronautics and Space Administration, Department of Energy