3D Printed Component Packages for Semiconductor Die

3D printing has existed for decades within certain manufacturing industries where many legal regimes, including patents, industrial design rights, copyright, and trademark may apply. However, 3D printing of electronic packages and components is more recent area of development. Paraphrasing the topic, this work willdevelop a 3D printing process concept that additively prints a 3D package around a bare semiconductor die where the package is tailored to fit the application. In doing so, we hope to enable domestic packaging manufacture through the flexibility of 3D printing, reducing dependence on non-domestic manufacturing. Further, within the foreign country, it is possible for the part to be counterfeited. 3D printing of a component package around a bare die should allow for the manufacturer to keep the packaging at the same location as the die manufacturing and reduce the risk of counterfeiting.Adv Materials Innovations, teamed with its partners propose to integrate best of breed anti-counterfeit technology with Terrapin Works 3D printed electronics packaging capability to achieve a solution to this problem.Approved for Public Release | 17-MDA-9395(24 Oct 17)