Low SWAP, 3D Printed Radiation Shielding For Microelectronics (1000-424)

SI2 Technologies, Inc. (SI2) proposes to develop 3D-printed, graded-atomic-number (Z) ionizing radiation shielding (1-piece cladding) for missile defense microelectronics.Leveraging SI2s extensive additive manufacturing experience, SI2s low-SWAP, low-cost shielding will be designed to protect both unmounted and board-mounted microelectronics. This approach will accommodate multiple types and sizes of semiconductor packages, including 484 ball Fine Pitch Ball Grid Array (FBGA) packages.In Phase I, SI2 will identify promising printed shield architectures for microelectronics protection.These architectures will be shown to mitigate single event effects from a LET > 20 [MeV-cm2]/mg particle and reduce the radiation dose-rate by 25%.In Phase II, the most promising printed shield architectures will be downselected and optimized so as to mitigate single event effects from a LET > 40 [MeV-cm2]/mg particle and reduce the radiation dose-rate by 50%.With support from industry partners, SI2 will then identify opportunities to transition its printed shield technology to the DoD for application to missile defense platforms (e.g., missile interceptors).Approved for Public Release | 17-MDA-9395(24 Oct 17)