2nd Phase II Radiation Shielding (SI Technologies)

SI2 Technologies, Inc. (SI2) proposes to develop 3D-printed for spacecraft microelectronics. Leveraging SI2’s extensive additive manufacturing experience, SI2’s low-SWaP, low-cost shielding will be designed to protect both unmounted and board-mounted microelectronics. This approach will accommodate multiple types and sizes of semiconductor packages, including 484 ball Fine Pitch Ball Grid Array (FBGA) packages. In Phase II, SI2 will identify promising printed shield architectures for microelectronics protection. These architectures will be shown to provide the required levels of shielding and survive a simulated spacecraft environment. With support from industry partners, SI2 will identify opportunities to transition its printed shielding technology to the DoD for application to space platforms (e.g., satellites). The proposed printed radiation shielding technology will afford robust microelectronics protection without the size, weight, power, cost, and schedule burden of conventional shield approaches. SI2’s shielding solution also has application to electronics used in nuclear facilities and medical facilities.