Solid State High Power Amplifier for Communications

In the Phase 1 program, ENGIN-IC studied the key technologies to develop a Solid State Power Amplifier (SSPA) to replace the Klystron Tube currently used for the Ground-based Midcourse Defense Element of the Ballistic Missile Defense System (BMDS). ENGIN-IC demonstrated a GaN Power amplifier MMIC design offering greater than 40-W saturated power with more than 45% efficiency, a 160-W sub module which integrated four of these MMICs, and a top level design that utilized these in a modular approach that achieved the High Power Amplifier (HPA) requirements with good margin. Using high reliability devices and a solid redundancy plan, reliability levels are raised significantly for the system. In Phase 2, ENGIN-IC will be advancing the top level designs such that final performance requirements can be generated for the key internal modules. ENGIN-IC will then finalize designs and fabricate these elements including the GaN MMIC and 160-W SSPA sub module. With these designs complete, the high risk elements of the full HPA design are significantly minimized and a future phase program can move forward to achieve the final objective system. Approved for Public Release | 16-MDA-8951 (15 December 16)