HPC Tool for Massively-Parallel Thermal Simulation of 3D and Dense Electronic Circuits
Award amount
$1,000,000Program and phase
SBIR · Phase IIAward year
2017Award details
- Awarding agency
- Department of Energy
- Branch
- Not reported
- Recipient company
- CAPESYM INC
- Proposal award date
- 2017-04-10
- Contract end date
- 2019-04-09
- UEI
- CSZST8YFP7K1
- Solicitation number
- DE-FOA-0001645
- Topic code
- 02a
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- High-Resolution Direct-Conversion X-ray Detectors for Low-Dose Imaging
- Crystal Growth and Characterization of Doped VUV Crystals
- Low-Cost High-Efficiency X-ray Imaging Panels for Field Radiography
- High Yield Growth and Fabrication of Spectroscopic Radiation Detection Semiconductors
- High Quantum Efficiency Scintillators for Dual Readout Calorimetry
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Advanced Electromagnetics and Multi-Physics Software Using MFEM
- A Real-Time Modeling and UQ Toolbox for Complex Subsurface Characterization
- SCR-Exa: Enhanced Scalable Checkpoint Restart (SCR) Library for Next Generation Exascale Computing Systems
- BENGI: A Bayesian ENGine for Insights
- Argobots: Harnessing Massive Concurrency with Tasks & Fine-grained Control of Scheduling
Research funding history
85 SBIR/STTR records share this UEI (1997–2025). Reported award amounts total $46,105,917. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Energy, Department of Homeland Security, Department of Health and Human Services, National Aeronautics and Space Administration